Pure indium foils make excellent thermal interface materials for chip to lid, lid to heatsink, device to board, and temporary TIM’s for testing applications.
FEATURES & BENEFITS
Indium imparts it’s unique properties in many indium solder alloy compositions. Key properties are:
- High Thermal Conductivity: >80W/m-k (bulk material)
- High Ductility: Indium can absorb CTE mismatch between semiconductors & package lids/heat sinks
- Compliant: Indium fills gaps and will wet to metallic and non-metallic surfaces
Available forms from AIM:
> Indium TIM’s: Standard and custom shapes to fit any package.
> Indium Foils: Any width/length/thickness for R&D and pilot scale production.
> Indium Alloys: Standard and custom alloys for use as solder-TIM’s
